Acrylonitrile Butadiene Styrene (ABS)
ABS is a versatile thermoplastic polymer widely used in electronic enclosures and structural components.
Technical Properties:
– Tensile Strength: 40-50 MPa
– Dielectric Strength: 15-16 kV/mm
– Heat Deflection Temperature (HDT): 90-100°C at 0.45 MPa
– Coefficient of Thermal Expansion: 70-90 × 10^-6 m/(m·K)
Design Considerations:
ABS is ideal for applications requiring good impact resistance and dimensional stability. Its low melting point (approximately 105°C) allows easy injection molding and 3D printing, making it suitable for rapid prototyping and mass production.
Potential Hazards:
While generally safe, ABS can release styrene and acrylonitrile monomers when heated above 400°C. Implement proper ventilation in manufacturing areas and consider alternative materials for high-temperature applications.